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BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR
Kód: 205187Na dotaz
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Parametre
Popis BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR
Hlavní využití
Virtualization, HPCCDN, Edge Nodes, Cloud Computing,
Data Center Optimized, Storage Headnode
Podrobnosti
https://www.supermicro.com/en/products/system/up/1u/sys-111c-nr
Specifikace
| Bundle obsahuje | |
|---|---|
| SYS-111C-NR | UP 1U X13SEDW-F, CSE-LB16TS-R860AW3 |
| EWCSC | 0% 3 YRS LABOR, 3 YRS PARTS, 1 YR CRS UNDER LIMITED WRNTY |
| P4X-EMR4509Y-SRN61-LCC | 4509Y 2P 8C/2.6G/125W (8/1.9, 4/2.7/105) 22.5M SGX64 DSA 7yr SP5 |
| 2xx MEM-DR516MB-ER48 | 16GB DDR5-4800 1RX8 (16Gb) RDIMM |
| 2x HDS-M2N4-480G0-E1-TXD-NON-080 | SSD M.2 NVMe PCIe4 480GB 1DWPD TLC D, 80mm |
| SKT-1424L-001B-FXC | SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC,LCC,DG1.0 ,RoHS |
| CBL-MCIO-1225M5Y | MCIO (x8 to 2 x4) STR,25CM,85OHM,RoHS |
| CBL-MCIO-1240AM5-X | MCIO (x8 to x8) STR,40CM,LNRV,85OHM,RoHS |
| MC0037 | ASSEMBLY FEE |
| Specifikace serveru | |
| Form Factor | 1U Rackmount Enclosure: 437 x 43 x 597mm (17.2" x 1.7" x 23.5") Package: 605 x 197 x 822mm (23.8" x 7.8" x 32.4") |
| Processor | Single Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Up to 64C/128T; Up to 320MB Cache |
| GPU | Max GPU Count: Up to 2 single-width GPU(s) Supported GPU: NVIDIA PCIe: T1000, L4, A2 CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect |
| System Memory | Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM |
| Drive Bays Configuration | Default: Total 10 bay(s) 10 front hot-swap 2.5" PCIe 5.0 NVMe*/SAS*/SATA drive bay(s) (*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110) |
| Expansion Slots | Default 2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) |
| On-Board Devices | SATA: SATA (6Gbps) ; RAID 0/1/5/10 support NVMe: NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) Chipset: Intel® C741 Network Connectivity: Via AIOM IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s) USB: 2 USB 3.2 Gen1 Type-A port(s) (rear) 2 USB 2.0 Type-A port(s) (front) Video: 1 VGA port(s) Serial: 1 COM port(s) (Rear) TPM: 1 TPM header |
| System Cooling | Fans: 6 middle cooling PWM 40x40x56mm Fan(s) |
| Power Supply | 2x 800W/860W Redundant (1 + 1) Titanium Level power supplies |
| System BIOS | BIOS Type: AMI 32MB SPI Flash EEPROM |
| Management | CPU: Monitors for CPU Cores, Chipset Voltages, Memory 8 Phase-switching voltage regulator FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connector |
| PC Health Monitoring | FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors Voltage: System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support |
| Dimensions and Weight | Weight: Gross Weight: 40 lbs (18.1 kg) Net Weight: 25 lbs (11.3 kg) Available Color: Black front & silver body |
| Operating Environment | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
| Motherboard | X13SEDW-F |
| Chassis | CSE-LB16TS-R0AWNP3 |
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